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| SiP(System in
Package) |
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System in Package is a combination of one or more wire bonded or flip chip dice with one or more passive components attached to a standard formal microelectronic package. The package forms a functional block or module that can be used as a standard component in board level manufacturing. OSET creates solution based upon customized product requirements and provides product services in assembly, SMT and testing at a lower cost. OSE's MMC, MPM and Image Sensor are based on SiP technology.
With microelectronic packages operating at higher electrical speed, issues such as noise immunity, cross talk, ground bounce, and other electrical parasitics have become major negative influences. Device manufacturer have resolved this issue by the adding of capacitors and other passive components to both wire-bonded and flip chip assembled products. OSE offers System in Package microelectronic solutions and benefits for many of today's demanding product applications such as microprocessors, graphic chips, chip sets, ASIC's cell based designs, and RF products.
OSE System in Package:
* MMC
* Embedded Passive Component
* Radio Module/Bluetooth
* MPM
* Image SensorĄVUnder Development
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| MMC(Multi-Media Card) |
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Mult-iMedia Cards weigh less than two grams and of a postage stamp, are the world's smallest (24mm x 32mm x 1.4mm) removable solid-state memory solutions for mobile applications, such as MP-3 music players, portable video games, laptop computers, personal digital assistants (PDAs), mobile telephones and digital cameras. These convenient, reliable, rugged and lightweight standardized data carriers store up to 64 Mbytes, sufficient for 64 minutes of MP-3 digital music, or approximately 40,000 book pages.
Multi-Media Cards use ROM technology for read-only applications and Flash technology for read/write applications. The cards are fast for excellent system performance; energy efficient for prolonged battery life in portable products; and cost-efficient for use in systems sold at consumer price points. This easy-to-install simple molded package has a seven pad (pin) serial interface which offers easy integration into various devices regardless of the microprocessor used. The Multi-Media Card has a wide variety of uses in some of the most exciting products on the market today.
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 | W/B Type |
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| SMT TYPE |
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| Process Flow |
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| Reliability Test (Under
Planning) |
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| Temperature | Operation: -25ĒJ/85ĒJ
Storage: -40ĒJ(168h)/85ĒJ(500h)
Junction temperature: max.
95ĒJ |
| Moisture and Corrosion | Operation: 25ĒJ/95% rel. humidity
Stress: 40ĒJ/93% rel. hum./500h
Salt Water Spray:3% NaCl/35C; 24h
acc. MIL STD 883 Method 1009 |
| ESD
Production | Contact Pads:
+/-4kV, Human body model according to ANSI EOS/ ESD- S5.1 - 1998
Non Contact Pads area:
+/-8kV (coupling plane discharge)
+/-15kV (air discharge)
Human body model
according to IEC61000-4-2 |
| Durability | 10.000 mating cycles; test T.B.D. |
| Bending | T.B.D |
| Torque | T.B.D |
| Drop
Test | 1.5m
free fall |
| UV
Light Exposure | UV:
200nm, 15Ws/cm2 according to ISO 7816-1 |
| Visual Inspection Shape and Form | No
warpage; no mold skin; complete form; no cavities
surface smoothness sigma-0.1mm/cm2 within contour; no
cracks; no pollution (fat, oil dust, etc.) | |
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| Embedded Passive Component |
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One of the strongest points of the SiP approach is the capability to remove large numbers of discrete components by integrating them into the interconnection structure, with the technique known as "embedded passives". The need for a package, interconnect board plus discrete components complicated the assembly of the hybrid microcircuit and increased volume and weight requirement. The technology could integrate these three functions would dramatically reduce size and assembly complexity with concurrent improvements in cost and reliability.
The application for
embedded passive components include consumer electronic products.
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| Process Flow |
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| Reliability Test |
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| Power
cycling test @ Iout 26-28Amps, 10000cycles
Temperature Humidity Bias Test @ Bias, 1000
hours
Temperature Cycling Test (-40ĒJ to 125ĒJ), 1000
cycles |
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| Bluetooth |
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Bluetooth wireless technology is a short-range radio technology that makes it possible to transmit signals over short distances between mobile computers, mobile phones, portable handheld devices and connectivity to the internet, and more.
Bluetooth wireless technology will simplify both communication and synchronization between devices. The technology will replace many of the proprietary cables we use in the home and office to connect devices together: telephones, printers, PDA's, desktop and laptop computers, fax machines, keyboards, joysticks ĄV almost any digital device that uses the Bluetooth wireless technology chip will be able to take advantage of the technology.
More than just a replacement for cables, Bluetooth wireless technology provides a universal bridge to existing data networks, a peripheral interface, and a mechanism to form small private and hoc groupings of connected devices away from fixed network infrastructures.
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| Radio Module |
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| Reliability Test |
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| Test | Condition | Method |
| Precondition | | JEDEC 22-A113-B Level 2 |
| Rapid change of temperature | -55
/ +125C , 1000 cycles after preconditioning | IEC
68-2-14 , Na |
| Rapid change of temperature | Samples soldered to PCB, -40 / +100C , 800 cycles
after preconditioning | IEC
68-2-14 , Na |
| Operating life
| Tj=+125C , 1000hrs, Vcc=3.0V | JEDEC 22-A108-A |
| Damp
heat with bias | 85C
/ 85%RH , 1000hrs , Vcc=3.0V after
preconditioning | JEDEC 22-A101-B |
| Storage | 150C
, 1000hrs | IEC
68-2-2 , test B |
ESD sensitivity
HBM | Min
req. 2000V | MIL-883.3015.7 |
| Vibration | Frequency 0.1-2KHz | IEC
68-2-6 test Fc |
| Resistance to solvents | | IEC
68-2-45, Xa | |
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| MPM(Multi Package Module) |
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The MPM is the second generation of MCM (Multi Chip Module). It focuses on enhancing DRAM performance in graphic package. With the technology, memory of function-work-pass can be directly mounted into graphic substrate, and forms a graphic package. Based on this concept, OSE can offer any module by combining package assembly, SMT and testing technology.
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| Image Sensors |
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Image Sensors are silicon devices that see. They are semiconductors devices designed to convert photons to electrons so that they can be processed, stored or displayed. Image Sensor consist of a number of different types of devices, including charge coupled devices (CCDs), the most common type of image sensor, as well as CMOS image sensors, contact image sensors, charge injection devices, photodiode arrays, and amorphous silicon sensors. The image sensor is at the heart of any digital camera, as well as in scanners and an array of astronomical, scientific, military, and medical devices. Electronics, once converted, must then be transferred and converted again to voltage which can be measured and turned into digital data.
The applications for image sensors have PC cameras, toys, dual mode cameras, mobile phone cameras, fax machines, scanners, and multifunction peripherals.
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