IC Packaging Services | OSE IC Packaging and Testing Services

Our IC packaging service includes:

Wafer probing
Back grinding
Full assembly
Dry baking
Drop shipment

Use the left menu to find out more about our available packages.

OSE is one of the world's fastest-growing electronics manufacturing services (EMS) providers. We are also one of the few world's leading electronics manufacturing services (EMS) providers specialized in high-mix manufacturing. We have offer electronics manufacturing services in US, Taiwan and China.

OSE is a leading IC packaging and testing services provider. We are also a leading Flash Memory Card Manufacturer.