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  • Packaging Services
    • Leadframe Packages
      • SOP
      • SSOP
      • TSOP
      • TSSOP
      • QFP
      • LQFP
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      • TDFN
      • TQFN
      • PLCC
    • Advanced Packages
      • LFBGA
      • TFBGA
      • LGA
  • Testing Services
    • Testing Systems
      • Credence SC312
      • HP 83000
      • Credence Duo Six
      • Credence Quartet One / One Plus
      • Credence TMT ASL1000
      • Teradyne A370
      • Teradyne Catalyst
    • Testing Handler
    • Wafer Prober
    • Lead Scanner
    • Tape and Reel
  • System in Package
    • MultiMediaCard (MMC)
    • Embedded Passive Components
    • Multi-Package Module
  • Quality Assurance
    • In-Process Quality and Reliability Control
    • Package Reliability Test Capability
    • Quality System
    • SPC Controlled Critical

Packaging Services

  • Leadframe Packages
    • SOP
    • SSOP
    • TSOP
    • TSSOP
    • QFP
    • LQFP
    • TQFP
    • TDFN
    • TQFN
    • PLCC
  • Advanced Packages
    • LFBGA
    • TFBGA
    • LGA

Advanced Packages

© Copyright 2009 Orient Semiconductor Electronics, Ltd. All rights reserved.

OSE is one of the world's fastest-growing electronics manufacturing services (EMS) providers. We are also one of the few world's leading electronics manufacturing services (EMS) providers specialized in high-mix manufacturing. We have offer electronics manufacturing services in US, Taiwan and China.

OSE is a leading IC packaging and testing services provider. We are also a leading Flash Memory Card Manufacturer.