Land Grid Array (LGA)

LGA is a BGA based package without solder balls. LGA has thinner and lighter package outline. It is especially suitable for application that required high electrical performance.

Application

Suitable for application that required high electrical performance IC.

Packaging Capability

Body size Lead count (I/O) Package height
2.5×2 ~ 19×19 mm 6 ~ 112 0.70 ~ 0.80 mm
Remark: Packages other than those listed aboved can be made available within 4 - 8 weeks.

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