Thin Profile Fine Pitch Ball Grid Array (TFBGA)

OSE's Thin Profile Fine Pitch BGA package is BT based substrate with mold height of to 0.4 mm. It offer small scale and light weight as well as cost-saving solutions for low ball counts of less than 300 I/O. The ball pitch ranges from 0.4 mm to 1.0 mm and is available in a full of peripheral array format to meet any small-size requirement.

Application

OSE's TFBGA is suitable for systems that require a smaller package size than PBGA, including memory, analog, flash, ASICs, RF devices. Applications include telecom equipment, cellular phones, notebooks, mini-notebooks, PDAs, wireless products, PCMCIA based prodcuts, etc.

Packaging Capability

Body size Ball pitch Ball count I/O Package height Ball size
3×3 ~ 19×19 mm 0.4/0.65/0.7/0.8/1.00 mm 28 ~ 322 0.6 ~ 1.20 mm 0.30 ~ 0.50 mm
Remark: Packages other than those listed aboved can be made available within 4 - 8 weeks.

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