Thin Dual Flat No Lead (TDFN)


OSE's TDFN is near CSP plastic encapsulated package with a copper lead frame. This package uses perimeter lands on the bottom of the package to make connection to PCB. This package also can use the exposed pad technology as a thermal enhancement. The die attach paddle is exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PCB. These enhancements enable the use of stable ground through the connection of down bonds or by an electrical connection through a conductive die attach material.


The small size and weight coupled with excellent thermal and electrical properities make the TDFN an ideal choice for a wide range of applications such as mobile telecommunication and PDA's.

Packaging Capability

Pkg. width Lead pitch Lead count
8 12
3×3 mm 0.65 mm ×  
3×3 mm 0.45 mm   ×
5×6 mm 1.27 mm ×  
1.9×3 mm 0.65 mm ×  
Max : 15 x 15 mm

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