Thin Quad Flat Package (TQFP)
TQFP family is a reduced body thickness plastic package. This package type is constructed using the latest wire bonding and molding technology to provide surface mount with a nominal body thickness of 1.0mm. It is suitable for applications where height and weight are a critical factor.
Application
TQFP give designers the needed low profile margin in designing and producing high performing products such as disk drives, pagers, wireless, CATV/RF modules, radio and other similar applications.
Packaging Capability
| Pkg. width | Lead pitch | Lead count | ||||
|---|---|---|---|---|---|---|
| 32 | 48 | 64 | 100 | 128 | ||
| 7×7×1.0 mm | 0.80 mm | × | ||||
| 7×7×1.0 mm | 0.50 mm | × | ||||
| 7×7×1.0 mm | 0.40 mm | × | ||||
| 14×14×1.0 mm | 0.50 mm | × | ||||
| 14×14×1.0 mm | 0.40 mm | × | ||||