Thin Small Outline Package (TSOP)

TSOP

Thin Small Outline Package (TSOP) is thin body size component; thickness is 1.0mm. TSOP packages have four sides and are rectangular. Type I TSOP have leads protruding from the width portion of the package. Lead counts range from 28 to 48. Package body size ranges from 8 x 14mm to 12 x 20mm. Type II TSOP have leads protruding from the length portion of the package. Lead counts range from 32 to 86. TSOP give users strong packaging choices for all types of applications. In addition they support the widest range of nonvolatile memory devices and also for other custom applications.

Application

TSOP 1 is for memory (SRAM, DRAM, FLASH, FSRAM) and is symbiotic with end-use products such as pagers, telecom/cellular, memory modules, PC (PCMCIA) cards. TSOP 2 is ideal for controllers, amplifiers, logic, data converters, interfaces and op amps.

Packaging Capability

Pkg. width Lead pitch Lead count
28 32 44 48
8×13.4 mm (Type I) 0.50 mm × ×    
8×20 mm (Type I) 0.50 mm   ×    
12×20 mm (Type I) 0.50 mm       ×
14×20 mm (Type I) 0.50 mm       ×
400 mil (Type II) 0.80 mm     ×  
400 mil (Type II) 1.27 mm   ×    

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