Thin Shrink Small Outline Package (TSSOP)


One of the front-runner of the SOIC family, TSSOP is smalle and lighter than the rest. Body sizes are 3.0mm, 4.4mm and 6.1mm. Lead counts range from 8 to 56. OSE not only shrink the package by decreasing the lead pitch, but also make it thinner than ever, offering quality and reliability at same time. OSE is a major manufacturer of TSSOP to customers worldwide.


Suitable for gate drivers, controllers, op amps, logic analog, memory (SRAM, DRAM, EPROM, E2PROM) comparators and optoelectronics, memory modules, disk drive, recordable optical disk, telephone handsets, speed dialers, video/audio and consumer electronics/appliances.

Packaging Capability

Pkg. width Lead pitch Lead count
8 10 14 16 20 24 28 48 56 64
173 mil 0.65 mm ×   × × × × ×      
240 mil (M)/S 0.50 mm             × × × ×
118 mil (MSOP) 0.65 mm ×                  
118 mil (MSOP) 0.50 mm   ×                
Exposed pad available.
(M)/S M is equivalent to 240 mil body width with 0.5mm lead pitch
V 173 body width with 0.4mm lead pitch.

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