In-Process Quality and Reliability Control
Incoming Quality Control
In-Process Quality Control
- Operation Condition
- Product Quality-Source
- Quality Control & Re-Call Monitoring
In-Process Reliability Monitor
- Epoxy Thickness Monitor
- Die Shear Test
- Bond Pull Test
- Ball Shear Test
- Bond Pad Cratering Monitor
- X-RAY Monitor
- Solder Thickness & Composition Test
- Solderability Test
- Marking Permanence Test
- Critical Dimension Monitor
- SAT Monitor
Quality Assurance Gate
- 2nd Optical
- 3nd Optical
- 4nd Optical
- Electricalt
Storage Environment
QA Engineering Monitor
- D.I.Water Bacteria Content
- D.I.Water Impurity Analysis
- Carbon Content Analysis
- Impurity Content Analysis of Raw Material
- ION Analysis
Package Reliability Test Capability
- Pressure Cooker Test
- Thermal Shock Test
- Temperature Cycle Test
- High Temperature Storage
- Pre-condition Level 1 to Level 6
- Highly Accelerated Stress Test (HAST)
Failure Analysis
- Package Decapsulation Equipment (Including BGA)
- X-Ray Inspection Equipment
- SEM (Scanning Electric Microscope)
- Scanning Acoustic Microscope
- High Power Microscope
- Atomic Absorption Spectrophotomenter
- Curve Tracer
- EDX
- Probe Station
