In-Process Quality and Reliability Control

Incoming Quality Control

  • Wafer
  • Raw Material

In-Process Quality Control

  • Operation Condition
  • Product Quality-Source
  • Quality Control & Re-Call Monitoring

In-Process Reliability Monitor

  • Epoxy Thickness Monitor
  • Die Shear Test
  • Bond Pull Test
  • Ball Shear Test
  • Bond Pad Cratering Monitor
  • X-RAY Monitor
  • Solder Thickness & Composition Test
  • Solderability Test
  • Marking Permanence Test
  • Critical Dimension Monitor
  • SAT Monitor

Quality Assurance Gate

  • 2nd Optical
  • 3nd Optical
  • 4nd Optical
  • Electricalt

Storage Environment

QA Engineering Monitor

  • D.I.Water Bacteria Content
  • D.I.Water Impurity Analysis
  • Carbon Content Analysis
  • Impurity Content Analysis of Raw Material
  • ION Analysis

Package Reliability Test Capability

  • Pressure Cooker Test
  • Thermal Shock Test
  • Temperature Cycle Test
  • High Temperature Storage
  • Pre-condition Level 1 to Level 6
  • Highly Accelerated Stress Test (HAST)

Failure Analysis

  • Package Decapsulation Equipment (Including BGA)
  • X-Ray Inspection Equipment
  • SEM (Scanning Electric Microscope)
  • Scanning Acoustic Microscope
  • High Power Microscope
  • Atomic Absorption Spectrophotomenter
  • Curve Tracer
  • EDX
  • Probe Station