Embedded Passive Components

One of the strongest points of the SIP approach is the capability to remove large numbers of discrete components by integrating them into the interconnection structure, with the technique known as "embedded passives". The need for a package, interconnect board plus discrete components complicated the assembly of the hybrid microcircuit and increased volume and weight requirement. The technology could integrate these three functions would dramatically reduce size and assembly complexity with concurrent improvements in cost and reliability.

The application for embedded passive components include consumer electronic products.

Process Flow

Process Flow


Power cycling test Iout 26-28 Amps, 10000 cycles
Moisture and Corrosion Bias, 1000 hours
ESD Production -40°C to 125°C, 1000 cycles