Multi-Package Module

The MPM is the second generation of MCM (Multi Chip Module). It focuses on enhancing DRAM performance in graphic package. With the technology, memory of function-work-pass can be directly mounted into graphic substrate, and forms a graphic package. Based on this concept, OSE can offer any module by combining package assembly, SMT and testing technology.

W/B Type

W/B Type W/B Type

FC Type

FC Type FC Type

Process Flow

Process Flow


Reliability test: Pre-con, Level III passed