Multi-Package Module
The MPM is the second generation of MCM (Multi Chip Module). It focuses on enhancing DRAM performance in graphic package. With the technology, memory of function-work-pass can be directly mounted into graphic substrate, and forms a graphic package. Based on this concept, OSE can offer any module by combining package assembly, SMT and testing technology.
W/B Type
FC Type
Process Flow
Reliability
| Reliability test: | Pre-con, Level III passed |
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