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Understanding the demands of the future, OSE combines 30 years' experience with unrivalled research and development resources to deliver the latest high performance solutions to customers across the globe. From lead frame IC assembly and test, through to advanced Flip Chip and CSP technologies,
OSE is clearly the market leading solutions provider.
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OSE offers IC package design and fabricates a full array of packages, with pin counts from 8 to more than 830. We also offer comprehensive IC testing capabilities that verify function availability of product for
customers.
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