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IC Home Packaging Services Testing Services System in Package          (SiP) Quality Assurance Locations

Services available for IC packaging include: - Wafer Probe, Backgrinding, Full Assembly and Test Capability Additional services include: - Dry bake, Burn-in and Drop-shipment Leadframe Packages: Quad Flat Packages (LQFP, TQFP) Small Outline Packages (SOP, SSOP, TSOP, TSSOP) MLP (TQFN, TDFN) < Select Conventional Package >       TDFN/TQFN (Thin Dual Flat No Lead / Thin Qaud Flat No Lead) SOP (Small Outline Package) TSOP (Thin Small Outline Package) SSOP (Shrink Small Outline Package) TSSOP (Thin Shrink Small Outline Package) LQFP (Low Profile Quad Flat Package) TQFP (Thin Quad Flat Package) QFP (Qual Flat Package) PLCC (Plastic Leaded Chip Carrier) Advanced Packages: Ball Grid Arrays (PBGA, TEBGA, MCM, MCP) CSP (LFBGA, FTFBGA, TFBGA) < Select Advanced Package >    LFBGA (Low Profile & Fine Pitch BGA) TFBGA (Thin Profile Fine Pitch BGA) MCM (Multi-Chip Module) LGA (Land Grid Array) System in Package (SiP): System in Package is a combination of one or more wire bonded or flip chip die with one or more passive components attached to a standard formal microelectronic package. The package forms a functional block or module that can be used as an assembled module in board level manufacturing. Read more for the development status..... Green Packages: In front of environmental awareness and government legislations, OSE migrates to lead-free and halogen-free packaging strategies, universally known as Green Packaging. Read more for the development status.....

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