TFBGA
TFBGA (Thin Fine-Pitch Ball Grid Array)
Small-sized, Good heat dissipation, High-efficiency performance, High density storage
Small-sized, Good heat dissipation, High-efficiency performance, High density storage
TFBGA is superior in its small form factor and sufficient I/O counts that could provide high capacity TFBGA products within a constrained space for both standard and customized products.
Application
• Storage device
Advantage
• Small Form Factor, High Leadcount
• Advanced Electrical Performance
• Pb-Free & Green Package
TFBGA Reliability Test Condition
Test samples will be subjected to Jedec Std MSL 3 pre-conditioning unless the customer has special requirements.
| Test Item | Application | Method | Condition | Remark |
| Pre-Condition | JEDEC-STD-22 | A113 | MSL 3 | |
| Temp. Cycle | JEDEC-STD-22 | A104 | -65+0/-10℃ & 150+15/-0℃ |
Air to Air 2 cycles per hour |
| High Temp. Storage | JEDEC-STD-22 | A103 | 150+10/-0℃ | |
| HAST | JEDEC-STD-22 | A118 |
130℃/85%R.H. 33.3 psia |
Without Bias |
Cross-section Diagram of
TFBGA
TFBGA Specification
| Package name | Ball count | Package size(mm) | Ball Pitch(mm) |
|---|---|---|---|
|
TFBGA(Memory)
|
63 ~ 316
|
9 X 11 ~ 18 X 14
|
0.5 ~ 1.0
|
* Offers Product Customization
