TSOP(Flash)
TSOP(I)
(Thin small outline package)
Small and Thin IC Package
(Thin small outline package)
Small and Thin IC Package
OSE provides TSOP-I for Flash TSOP with 48 pin counts and the package thickness is 1.0mm.
Application：
•Portable Electronic Devices
• SSD product
• USB
Advantage：
•Small-sized, slim type and light
•Steady yield performance
•Lower cost
•Lead free
• TSOP(I) Body size : 12x18mm & 14x18mm
• Meet JEDEC Standard
TSOP(Flash) Reliability Test Condition
Test samples will be subjected to Jedec Std MSL 3 pre-conditioning unless the customer has special requirements.
| Test Item | Application | Method | Condition | Remark |
| Pre-Condition | JEDEC-STD-22 | A113 | MSL 3 | |
| Temp. Cycle | JEDEC-STD-22 | A104 | -65+0/-10℃ & 150+15/-0℃ |
Air to Air 2 cycles per hour |
| High Temp. Storage | JEDEC-STD-22 | A103 | 150+10/-0℃ | |
| Pressure Cooker | JEDEC-STD-22 | A102 | 121℃/100%R.H. 29.7 psia |
|
| HAST | JEDEC-STD-22 | A118 | 130℃/85%R.H. 33.3 psia |
Without Bias |
| Steady temp/Humidity | JEDEC-STD-22 | A101 | 85℃/85%R.H. | Without Bias |
Cross-section Diagram of TSOP(I)
TSOP(I) Specification
| Package | Pin Count | Package size(mm) |
|---|---|---|
|
TSOP-I
|
48
|
12*20
14*20 |
