Wafer Probing Test
| Specification / Machine | UF200 | UF3000 Ex-e |
| Wafer Size(inch) | 6″,8″ | 8″,12″ |
| Temperature | 25°C~150°C | -40°C~150°C |
| Interface | GPIB | GPIB |
| Other | INK Solution | |
The wafer prober is capable of handling 8 and 12-inch wafers.
With specific drive motor, X-Y axis could achieve high speed, soundless, high precision with high output while the Z axis applies 4-axle drive mechanism to enhance the contact stability during probing and ensure the quality of each die.
Test of Automotive Parts
OSE supports testing of automotive parts. Major applications are automotive infotainment system, vehicle motion control and safety system, automotive camera system and vehicle diagnostic system.
Handler
COHU: CASTLE ,RASCO SO-1000T
Hon Tech : HT 9040S
Seiko Epson : NS 6040
YTEC : YT 6140
| Package Type | BGA | LFBGA | QFP | LQFP | SSOP | QFN |
| Dimension(mm) | 19x19 ~ 27x27 | 9x9 ~ 10x10 | 14x20 ~ 28x28 | 7x7 ~ 14x14 | 300mil | 4x4 ~ 8x8 |
| PIN Out | 289L ~ 400L | 100L | 128L ~ 208L | 48L ~ 128L | 48L | 24L ~ 64L |
| Test Site (Max) | 4 | |||||
| Temp.Range | -40°C ~ 125°C | |||||
Flash Memory Test
NAND/Embedded Flash Test service solution.
OSE provide Memory test platform for TSOP/eMCP/eMMC/LPDDR with high DUT handler and controller test solution accordingly, either or apply the high precision auto test equipment and optional high/low temperature burn-in system. Our services provide not only the most compatibility but also stability production environment to make the product applying to smart phone, tablet, digital camera, mobility use, and personal storage device.
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System Level Test
OSE has customized testing configuration with System Level Test handler to achieve the functional test of high efficient products. We provide stable testing environment to shorten the lead in time and then increase productive capacity.
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Integrated Circuit function Test
OSE provide function test of integrated circuit.
Major application of integrated circuit : various devices of electrical installation, smart phone and PC’s motherboard ; ESD protection of device; : various devices of communication installation.
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Handler-Pick and Place
- Package type: QFP, QFN, BGA, TSOP , SSOP
- Package size: 3x3~42x42mm
- Test site: Max.16
- Temp. Range: -50°C~130°C
- Manufacturer:
Hon. Tech
Seiko Epson
Delta Design
Handler-Gravity
- Package type: SOP, SSOP, TSSOP
- Package size: 118-300MIL
- Test site: Max.4
- Temp. Range: -50°C~150°C
- Manufacturer: Rasco
Handler-Bowl Feeder
- Package type: QFN, DFN
- Package size: 3x3~5x5mm
- Test site: Max. 2
- Temp. Range: Ambient
- Manufacturer: SRM
