Wafer Probing Test
| Specification / Machine | UF200 | UF3000 Ex-e |
| Wafer Size(inch) | 6″,8″ | 8″,12″ |
| Temperature | 25°C~150°C | -40°C~150°C |
| Interface | GPIB | GPIB |
| Other | INK Solution | |
The wafer prober is capable of handling 8 and 12-inch wafers.
With specific drive motor, X-Y axis could achieve high speed, soundless, high precision with high output while the Z axis applies 4-axle drive mechanism to enhance the contact stability during probing and ensure the quality of each die.
Test of Automotive Parts
OSE supports testing of automotive parts. Major applications are automotive infotainment system, vehicle motion control and safety system, automotive camera system and vehicle diagnostic system.
Handler：Delta Design : Castle
Rasco : SO - 1000T
Hon Tech : HT 9040S
Seiko Epson : NS 6040
YTEC : YT 6140
Package Type： BGA, LFBGA, QFP, LQFP, SSOP, QFN
Package Size：
BGA (19x19 289L~ 27x27 400L),
LFBGA (9x9 100L~ 10x10 100L),
QFP (14x20 128L~ 28x28 208L),
LQFP (7x7 48L~ 14x14 128L),
SSOP (300mil 48L),
QFN (4x4 24L~ 8x8 64L)
Test Site：Max. 4
Temp. Range： -40°C~ 125°C.
Flash Memory Test
NAND/Embedded Flash Test service solution.
OSE provide Memory test platform for TSOP/eMCP/eMMC/LPDDR with high DUT handler and controller test solution accordingly, either or apply the high precision auto test equipment and optional high/low temperature burn-in system. Our services provide not only the most compatibility but also stability production environment to make the product applying to smart phone, tablet, digital camera, mobility use, and personal storage device.
| Type | eMMC | eUFS | eMCP | ePOP | ||||
|
PKG Size |
153L | 153L | 162L | 221L | 136L | |||
| 11.5 X 13 | 7.6 X 11.1 | 9 X 7.5 | 8 X 8.5 | 11.5 X 13 | 11.5 X 13 | 11.5 X 13 | 10 X 10 | |
| Apply |
SmartPhone Smart Wearable Device Automotive Part Portable Storage Device Tablet |
SmartPhone Smart Wearable Device |
SmartPhone Tablet Smart Wearable Device |
SmartPhone Smart Wearable Device |
||||
| Machine | HON TECH | |||||||
| Type | SSD | TSOP | DDR | LPDDR | USB | Micro SD | SD | |||||
|
PKG Size |
132L | 152L | 48L | 78L | 178L | 200L | 4L | 8L | 9L | |||
| 12X18 | 14X18 | 12X20 | 7.5 X 12 | 11 X 11.5 | 12 X 11.5 | 10 X 14.5 | 11.3X15 | 11.3X20 | 11.3X24.8 | 11 X 15 | 24 X 32 | |
| Apply | Disk | Disk |
Disk
Modem- Camera |
SmartPhone Tablet | SmartPhone Tablet | SmartPhone Tablet | Portable Media Player Portable Storage Device SmartPhone Camera | Portable Media Player SmartPhone Camera Dash Cam | Portable Media Player SmartPhone Camera Dash Cam | |||
| Machine | HON TECH | |||||||||||
System Level Test
OSE has customized testing configuration with System Level Test handler to achieve the functional test of high efficient products. We provide stable testing environment to shorten the lead in time and then increase productive capacity.
| Type | WQFN | LQFP | WQFN | TQFN | SSOP | TSSOP | |||
| PKG Size (mm) |
48L | 48L | 28L | 28L | 32L | 28L | 24L | 20L | |
| 6 X 6 | 7 X 7 | 5 X 5 | 4 X 4 | 4 X 4 | 209MIL | 150MIL | 150MIL | 173MIL | |
| Terminal application | USB3.0 Flash application, 3C information peripheral control chip | USB2.0 information peripheral application SD card control chip. Bluetooth video device, Bluetooth mobile transmission device, Bluetooth wearable device | USB2.0 information peripheral application 3C information peripheral control chip | Bluetooth video device, Bluetooth mobile transmission device, Bluetooth wearable device | 3C information peripheral control chip , NB-Cam control chip | 3C information peripheral control chip , NB-Cam control chip |
3C information peripheral control chip , NB-Cam control chip | Bluetooth video device, Bluetooth mobile transmission device, Bluetooth wearable device | |
| Handler | HON TECH , SEIKO EPSON | RASCO | |||||||
Integrated Circuit function Test
OSE provide function test of integrated circuit.
Major application of integrated circuit : various devices of electrical installation, smart phone and PC’s motherboard ; ESD protection of device; : various devices of communication installation.
Tester
Advantest , Teradyne , LTX-Credence , Chroma , YTEC
Handler
Pick and Place: Hon. Tech, Seiko Epson, Delta Design
Gravity: Rasco, Multitest
Bowl Feeder: SRM
Handler-Pick and Place
- Package type: QFP, QFN, BGA, TSOP , SSOP
- Package size: 3x3~42x42mm
- Test site: Max.16
- Temp. Range: -50°C~130°C
- Manufacturer:
Hon. Tech
Seiko Epson
Delta Design
Handler-Gravity
- Package type: MSOP, SOP, SSOP, TSSOP, PDIP, PLCC
- Package size: 118-300MIL
- Test site: Max.4
- Temp. Range: -50°C~150°C
- Manufacturer: Rasco, Multitest
Handler-Bowl Feeder
- Package type: QFN, DFN
- Package size: 3x3~5x5mm
- Test site: Max. 2
- Temp. Range: Ambient
- Manufacturer: SRM
