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Semiconductor IC Packaging & Testing Services

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Wire Bond Packaging - Memory IC

Flash Memory Card

microSD&SD
UFS Card
USB

Embedded Product

eUFS
eMMC
eMCP
ePoP
uSSD
TFBGA

* Offers Product Customization

Wire Bond Packaging - Logic IC

Lead Frame

DFN/QFN
TSOP/TSSOP/SOP/SSOP
LQFP/TQFP

Substrate

LFBGA/TFBGA/HSBGA
LGA

* Offers Product Customization

Flip Chip Packaging

FCCSP
HSFCCSP
eUFS
uSSD
FC / Sip
(Wettable) FCQFN

* Offers Product Customization

Testing Services