LFBGA/TFBGA/HSBGA
LFBGA/TFBGA/HSBGA
Providing the most advantageous design space
Providing the most advantageous design space
Chip Scale Packages, TFBGA (Thin Profile Fine Pitch Ball Grid Array) and LFBGA (Low Profile Fine Pitch Ball Grid Array) could further reduce body size and meet the requirement of high pin count which optimized design space and high-density packaging techniques, including standard and customization products.
TFBGA (Thin Profile Fine Pitch Ball Grid Array) : Package total height is less than 1.2mm (including 1.2mm).
LFBGA (Low Profile Fine Pitch Ball Grid Array) : Package total height is greater than 1.2mm and less than 1.7mm (including 1.7mm).
HSBGA (Heat Sink Ball Grid Array)：Add metal heat sink on the surface of TFBGA / LFBGA to improve heat dissipation.
Application
• Memory
• Portable Consumer Product
• Cell Phone
• Radio
• Personal Computer
• Automobile
• Controller
• Optoelectronic Component
Advantage
• Meet JEDEC Standard
• Multi-die Production Capability
• Turnkey Solution
• RoHS Compliant
TFBGA/LFBGA Reliability Test Condition
Test samples will be subjected to Jedec Std MSL 3 pre-conditioning unless the customer has special requirements.
| Test Item | Application | Method | Condition | Remark |
| Pre-Condition | JEDEC-STD-22 | A113 | MSL 3 | |
| Temp. Cycle | JEDEC-STD-22 | A104 | -65+0/-10°C & 150+15/-0°C |
Air to Air 2 cycles per hour |
| High Temp. Storage | JEDEC-STD-22 | A103 | 150+10/-0°C | |
| Pressure Cooker | JEDEC-STD-22 | A102 | 121°C/100%R.H. 29.7 psia |
|
| HAST | JEDEC-STD-22 | A118 | 130°C/85%R.H. 33.3 psia |
Without Bias |
| Steady temp./ Humidity |
JEDEC-STD-22 | A101 | 85°C/85%R.H. | Without Bias |
Cross-section Diagram of LFBGA/TFBGA/HSBGA
LFBGA/TFBGA/HSBGA Specification
| Package name | Package Profile | Ball Count | Package size(mm) | Total Height(mm) | Ball Pitch(mm) |
|---|---|---|---|---|---|
|
LFBGA
|
Low Profile Fine Pitch Ball Grid Array
|
24 ~ 324
|
3 X 3 ~ 15 X 15 |
1.20 ~ 1.70 mm
(including 1.7mm) |
Fine Solder Ball Pitch |
|
TFBGA
|
Thin Profile Fine Pitch Ball Grid Array
|
24 ~ 324
|
3 X 3 ~ 15 X 15 |
1.20 ~ 1.20 mm
(including 1.2mm) |
Fine Solder Ball Pitch |
|
HSBGA
|
Heat Sink Ball Grid Array
|
24 ~ 324
|
3 X 3 ~ 15 X 15 |
---
|
Fine Solder Ball Pitch |
* Offers Product Customization
