Flip Chip Package
Flip Chip Package
Flip chip is a process to flip the chip to connect with substrate or leadframe. Flip chip contains conductive bumps all over the chip’s surface which replace wires for its interconnection.
Hence, the I/O pads can be increased through designed from sides to surface area. With the shorter circuit path, the chip size and signal interference can be reduced and the electrical performance could be enhanced.
Application
• Memory
• Controller
• Computer
• Communication
• Power IC
Cross-section Diagram of Flip Chip Package
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Flip Chip Specification
| Package Name | Pin Count | Package Size(mm) |
|---|---|---|
|
FCCSP
|
24 ~ 529
|
3 X 3 ~ 12 X 12
|
|
HSFCCSP
|
198 ~ 576 |
7.5 X 11 ~ 16 X 16
|
|
eUFS
|
153 |
11 X 13 ~ 11.5 X 13
|
|
uSSD
|
247 ~ 345 |
13 X 11.5 ~ 16 X 20
|
|
FC / SiP
|
18 ~ 218 |
8.6 X 7 ~ 12 X 12
|
|
(Wettable) FCQFN
|
12 ~62 |
2 X 3 ~ 3.5 X 9
|
* Offers Product Customization
