eMCP
eMCP (embedded Multi Chip Package)
Highly Integrated、Small-sized、Reduce the Cost
Highly Integrated、Small-sized、Reduce the Cost
OSE provides several JEDEC compliant assembly solutions for eMCP;
eMCP is highly integrated since it combines eMMC, low-power consuming DRAM into one package which is advantageous to accelerate new product development, simplify PCB design and reduce the cost.
Application
• Smartphone
• Tablet
• Wearable device
• IoT device
Advantage
• Small-sized (compared to eMMC)
• Speed up the pace of new product development
• Easier for our customers to do further design based on its simple circuit
eMCP Reliability Test Condition
Test samples will be subjected to Jedec Std MSL 3 pre-conditioning unless the customer has special requirements.
| Test Item | Application | Method | Condition | Remark |
| Pre-Condition | JEDEC-STD-22 | A113 | MSL 3 | |
| Temp. Cycle | JEDEC-STD-22 | A104 | -65+0/-10℃ & 150+15/-0℃ |
Air to Air 2 cycles per hour |
| High Temp. Storage | JEDEC-STD-22 | A103 | 150+10/-0℃ | |
| HAST | JEDEC-STD-22 | A118 | 130℃/85%R.H. 33.3 psia |
Without Bias |
Cross-section Diagram of
eMCP
eMCP Specification
| Package name | Ball Count | Package size(mm) | Ball Pitch(mm) |
|---|---|---|---|
|
eMCP SIP
|
221/254
|
13 X 11.5
|
0.5
|
* Offers Product Customization
