LGA
LGA
LGA (Land Grid Array Package) is similar to BGA package without solder ball, thus could further reduce package height with thinner and lighter package profile. Especially suitable for application that requires high electrical performance.
Application
• Memory
• Portable Consumer Product
• Cell Phone
• Radio
• Personal Computer
• Automobile
• Controller
• Optoelectronic Component
Advantage
• Meet JEDEC Standard
• Multi-die Production Capability
• Turnkey Solution
• RoHS Compliant
LGA Reliability Test Condition
Test samples will be subjected to Jedec Std MSL 3 pre-conditioning unless the customer has special requirements.
| Test Item | Application | Method | Condition | Remark |
| Pre-Condition | JEDEC-STD-22 | A113 | MSL 3 | |
| Temp. Cycle | JEDEC-STD-22 | A104 | -65+0/-10°C & 150+15/-0°C |
Air to Air 2 cycles per hour |
| High Temp. Storage | JEDEC-STD-22 | A103 | 150+10/-0°C | |
| HAST | JEDEC-STD-22 | A118 | 130°C/85%R.H. 33.3 psia |
Without Bias |
| Steady temp./ Humidity |
JEDEC-STD-22 | A101 | 85°C/85%R.H. | Without Bias |
Cross-section Diagram of LGA
LGA Specification
| Package name | Package Profile | Pin Count | Package size(mm) | Total Height(mm) |
|---|---|---|---|---|
|
LGA
|
Land Grid Array
|
24 ~ 324
|
3 X 3 ~ 15 X 15
|
0.61 ~ 1.25 |
* Offers Product Customization
