质量管理系统

质量政策

以最佳的制程能力及持续不断的改善,
满足客户的最高满意度。

华泰电子以客户的需求为导向,发展多个管理系统,质量与服务深受客户的青睐,也与相当多的重要客户成为事业上的好伙伴。
华泰电子为历史悠久的国际级半导体封装测试厂,封装技术能力领先业界,我们承诺为所交付给客户的产品与服务能符合客户需求,为客户做好品质把关,并透过不断地持续改善,以满足客户的需求。

质量管理系统

华泰电子依据IATF 16949以及ISO 9001建立质量管理系统体系,建立了六大客户导向流程:客户沟通、产品与流程发展、采购与物控、订单处理、生产制造与售后服务,并定义各项流程的关键绩效指标,持续衡量与监控过程的效率与有效性。此外,华泰电子也通过IATF 16949、ISO 9001、ISO 14001、OHSAS 18001、CNS 15506、ANSI/ESD S20.20等认证。

全面质量管理

华泰电子依据IATF 16949以及ISO 9001建立质量管理系统体系,发展以客户为导向的管理流程,善用多项质量管理工具,持续量测与监控各项流程的效率与有效性,来满足客户需求与期待,以提升竞争的优势。

国际认证

IATF 16949:2016

ISO 9001:2015

ISO 14001:2015

OHSAS 18001:2007

ANSI/ESD S20.20 :2014

失败分析实验室

华泰电子拥有先进的仪器与实验设备,有能力依厂内及客户的回馈进行相关性的失败分析(Failure Analysis, FA ) ,进行持续性的品质改善。

需求

客户回馈/内部需求

非破坏性分析

■Curve Tracer
■SAM
■X-Ray
■SEM&EDX
■Digital Microscope
■High/Low optical Microscope

破坏性分析

■Grinding/Polishing Machine
■Precison sectioning Saw
■Probe Station
■Laser Decap
■Ion Milling

报告

分析报告

非破坏性分析

Curve Tracer

KEITHLEY 2600-PCT

Capability

30W, 2000V/0.1A,20V/1.5A

Application

Curve tracer is a electronic test equipment used to analyze the characteristics of semiconductor devices.

X-ray

SEC X-eye SF-160

Capability

Real time observation

Application

X-ray is used for illustrate the internal structure through x-ray.

SAM (Scanning Acoustic Microscope)

Sonoscan P300

Capability

Transducer frequency:
10MHz/15MHz/30MHz/50MHz/100MHz

Application

SAM is used to examine, measure and photograph the IC structure with supersonic waves.

SEM (Scanning Electron Microscope) & EDS (Energy Dispersive Spectrograph)

Hitachi SU8010(SEM)
HORIBA X-max(EDS)

Capability

A/V.:0.5KV~30KV,
Magnification: 10X~100000X

Application

SEM is a type of electron microscope that produces images of a sample by scanning the surface with a focused beam of electrons.
EDS is an analytical technique used for the elemental analysis or chemical characterization of a sample.

Digital Microscope

KEYENCE VHX-6000

Capability

Real Zoom Lens: 20~200X/ 100X~1000X

Application

Digital microscope is an optical microscope that uses optics and a digital camera to magnify the sample with 3D contrast (DOF) to output to the monitor .

High/Low Power Optical Microscope

Nikon LV150

Capability

Eyepiece: 10X
Objective Lens:
2.5X/10X/20X/50X/100X

Application

High/Low Power Optical Microscope is a type of microscope to use visible light and a system of lenses to magnify the preliminary inspection of sample surface structure.

破坏性分析

Grinding/Polishing Machine

Struers Tegramin-20

Capability

Variable platen speed:
40~600 rpm

Application

The Grinding and Polishing machine is the tool used to grind/polish the sample near-by the suspected point for further investigations.

Precision Sectioning Saw

Allied 20-1000

Capability

Various Blade Type, Max Speed:4000 rpm

Application

Precision Sectioning Saw is the machine tools used for cutting the sample before grinding.

Laser Decap

Con Semi FAT cat II

Capability

I.R. Laser: 20 watt

Application

Laser Decap is the process of removing the protective cover of a microchip so that the contained die is revealed for visual inspection of the micro circuitry imprinted on the die.

Ion Milling

Hitachi IM4000

Capability

A/ V : 0 to 6 kV
Milling rate (max.) : (Materials Si)
For X-section milling: 300μm/hour
For Flat milling: 2~20μm/hour

Application

Ion milling machine thins the sample until it is transparent to electrons by firing ions at the surface from an angle and sputtering material from the surface.

Probe Station

MM 6000

Capability

4 Manipulator

Application

Probe station is used to physically acquire signals from the internal nodes of a semiconductor device.

Failure Analysis Equipment

S/NEquipmentManufacturerModelSetCapability
1.SAM(Scanning Acoustic Microscope)SonoScanP3001Transducer frequency: 10MHz/15MHz/30MHz/50MHz/100MHz
2.SEM(Scanning Electron Microscope)HitachiS-3500N1A/V.:5KV~20KV,
Magnification: 10X~100000X
SU80101A/V.:0.5KV~30KV, Magnification: 10X~100000X
3.EDS(Energy Dispersive Spectrograph)HORIBAX-max1Z: 5~92, detector area:50mm²
4.Curve TracerTektronix370A10.08W~220W, Max.2000V
KEITHLEY2600-PCT130W, 200V/0.1A, 20V/1.5A
5.Probe StationMM600014 Manipulator
6.High/Low Power Optical MicroscopeNikonLV 1501Eyepiece:10X,
LV 150N1Objective Lens:2.5X/10X/20X/50X/100X
OPTIPHOT-1501Eyepiece:10X, Objective Lens:5X/20X/50X/100X
7.Digital MicroscopeKEYENCEVHX-10001Real Zoom Lens: 20~200X/ 100X~1000X
VHX-60001Real Zoom Lens: 20~200X/ 100X~2000X
8.Cross Section MachineAlliedMET PREP 81Variable Speed Control: 40~500 rpm
M-PREP5TM1Variable Speed with digital display: 10-500 rpm
PH-3/AD-51Variable platen speed: 40~600 rpm
StruersTegramin-201Variable platen speed: 40~600 rpm
9.Precision Sectioning SawAllied20-10002Various Blade Type, Max Speend:4000 rpm
10.X-rayFein FocusFX100.202Real time observation
SECX-eye SF-1601Real time observation
11.Ion MillingHitachiIM40001A/ V : 0 to 6 kV
Milling rate (max.) : (Materials Si)
For X-section milling: 300μm/hour
For Flat milling: 2~20μm/hour
12.Laser DecapCon SemiFAT cat II1I.R. Laser: 20 watt

华泰电子依据IATF 16949以及ISO 9001建立品质管理系统体系,发展以客户为导向的管理流程,善用多项品质管理工具,持续衡量与监控各项流程的效率与有效性,来满足客户需求与期待,以提升竞争的优势。

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