质量政策
以最佳的制程能力及持续不断的改善，
满足客户的最高满意度。
华泰电子以客户的需求为导向，发展多个管理系统，质量与服务深受客户的青睐，也与相当多的重要客户成为事业上的好伙伴。
华泰电子为历史悠久的国际级半导体封装测试厂，封装技术能力领先业界，我们承诺为所交付给客户的产品与服务能符合客户需求，为客户做好品质把关，并透过不断地持续改善，以满足客户的需求。
质量管理系统
华泰电子依据IATF 16949以及ISO 9001建立质量管理系统体系，建立了六大客户导向流程：客户沟通、产品与流程发展、采购与物控、订单处理、生产制造与售后服务，并定义各项流程的关键绩效指标，持续衡量与监控过程的效率与有效性。此外，华泰电子通过IATF 16949、ISO 9001、ISO 13485、AS9100、ISO 14001、ISO 45001、ANSI/ESD S20.20等认证。
全面质量管理
华泰电子依据IATF 16949以及ISO 9001建立质量管理系统体系，发展以客户为导向的管理流程，善用多项质量管理工具，持续量测与监控各项流程的效率与有效性，来满足客户需求与期待，以提升竞争的优势。
国际认证
透过取得各项的认证来达成我们对质量的承诺，我们不仅仅是导入这些国际标准，而且要持续改善整体质量管理系统的有效性。亦符合TAA贸易协议法规范。
封装测试服务
IATF 16949:2016
ISO 9001:2015
电子制造服务
IATF 16949:2016
ISO 9001:2015
ISO 13485:2016
AS9100:D
环境与职业安全卫生管理
ISO 14001:2015
ISO 45001:2018
CNS 45001:2018
ANSI/ESD S20.20 :2021
ISO 50001:2018
ISO 46001:2019
ISO 14064-1:2018 (2021年)
ISO 14064-1:2018 (2022年)
资讯安全
ISO/IEC 27001:2022
失败分析实验室
华泰电子拥有先进的仪器与实验设备，有能力依厂内及客户的回馈进行相关性的失败分析(Failure Analysis, FA ) ，进行持续性的品质改善。
需求
客户回馈/内部需求
非破坏性分析
■Curve Tracer
■SAM
■X-Ray
■SEM&EDX
■Digital Microscope
■High/Low optical Microscope
破坏性分析
■Grinding/Polishing Machine
■Precison sectioning Saw
■Probe Station
■Laser Decap
■Ion Milling
报告
分析报告
非破坏性分析
Curve Tracer
KEITHLEY 2636B
Capability
1fA/1mV
Application
Curve tracer is a electronic test equipment used to analyze the characteristics of semiconductor devices.
X-ray
SEC X-eye SF-160
Capability
Real time observation
Application
X-ray is used for illustrate the internal structure through x-ray.
SAM (Scanning Acoustic Microscope)
Sonoscan D9650
Capability
Transducer frequency:
15MHz/30MHz/50MHz/100MHz
Application
SAM is used to examine, measure and photograph the IC structure with supersonic waves.
SEM (Scanning Electron Microscope) & EDS (Energy Dispersive Spectrograph)
Hitachi SU8010(SEM)
HORIBA X-max(EDS)
Capability
A/V.:0.5KV~30KV,
Magnification: 10X~100000X / Z：5~92
Detector area：50mm²
Application
SEM is a type of electron microscope that produces images of a sample by scanning the surface with a focused beam of electrons.
EDS is an analytical technique used for the elemental analysis or chemical characterization of a sample.
Digital Microscope
KEYENCE VHX-7000 / EA300
Capability
Real Zoom Lens: 20X~4000X / Z: 1~92
Application
Digital microscope is an optical microscope that uses optics and a digital camera to magnify the sample with 3D contrast (DOF) to output to the monitor .
High/Low Power Optical Microscope
Nikon LV150
Capability
Eyepiece: 10X
Objective Lens:
2.5X/10X/20X/50X/100X
Application
High/Low Power Optical Microscope is a type of microscope to use visible light and a system of lenses to magnify the preliminary inspection of sample surface structure.
破坏性分析
Grinding/Polishing Machine
Struers Tegramin-20
Capability
Variable platen speed:
40~600 rpm
Application
The Grinding and Polishing machine is the tool used to grind/polish the sample near-by the suspected point for further investigations.
Precision Sectioning Saw
Allied 20-1000
Capability
Various Blade Type, Max Speed:4000 rpm
Application
Precision Sectioning Saw is the machine tools used for cutting the sample before grinding.
Laser Decap
Con Semi FAT cat II
Capability
I.R. Laser: 20 watt
Application
Laser Decap is the process of removing the protective cover of a microchip so that the contained die is revealed for visual inspection of the micro circuitry imprinted on the die.
Ion Milling
Hitachi IM4000
Capability
A/ V : 0 to 6 kV
Milling rate (max.) : (Materials Si)
For X-section milling: 300μm/hour
For Flat milling: 2~20μm/hour
Application
Ion milling machine thins the sample until it is transparent to electrons by firing ions at the surface from an angle and sputtering material from the surface.
Probe Station
MM 6000
Capability
4 Manipulator
Application
Probe station is used to physically acquire signals from the internal nodes of a semiconductor device.
Failure Analysis Equipment
| S/N | Equipment | Manufacturer | Model | Set | Capability |
| 1 | High/Low Power Optical Microscope | Nikon | LV 150 | 1 |
Eyepiece:10X, Objective Lens:2.5X/10X/20X/50X/100X |
| LV 150N | 1 | ||||
| 2 | Digital Microscope | KEYENCE | VHX-7000 / EA300 | 1 | Real Zoom Lens: 20~2000X / Z: 1~92 |
| VHX-7000 | 1 | Real Zoom Lens: 20~4000X | |||
| 3 | X-ray | SEC | X-eye SF-160 | 1 | Real time observation |
| YXLON | Y.CHEETAH | 1 | |||
| COUGAR | 2 | ||||
| Y.COUGAR SMT | 4 | ||||
| 4 | SAM (Scanning Acoustic Microscope) | SonoScan | D9650 | 1 | Transducer frequency: 15MHz/ 30MHz/50MHz/ 100MHz |
| 5 | Curve Tracer | KEITHLEY | 2636B | 2 | Resolution: 1fA/1mV |
| 6 | Laser Decap | Con Semi | FAT cat II | 1 | I.R. Laser: 20 watt |
| 7 | SEM (Scanning Electron Microscope) | Hitachi | S-3500N | 1 | A/V.:5KV~20KV, Magnification: 10X~100000X |
| SU8010 | 1 | A/V.:0.5KV~30KV, Magnification: 10X~100000X / Z：5~92 |
|||
| 8 | EDS (Energy Dispersive Spectrograph) | HORIBA | X-max | 1 | Detector area：50mm² |
| 9 | Probe Station | MM | 6000 | 1 | 4 Manipulator |
| 10 | Cross Section Machine | Struers | Tegramin-20 | 1 | Variable platen speed: 40~600 rpm |
| 11 | Ion Milling | Hitachi | IM4000 | 1 |
A/ V : 0 to 6 kV Milling rate (max.) : (Materials Si) For X-section milling: 300μm/hour For Flat milling: 2~20μm/hour |
| 12 | Precision Sectioning Saw | Allied | 20-1000 | 1 | Various Blade Type, Max Speend:4000 rpm |
华泰电子依据IATF 16949以及ISO 9001建立品质管理系统体系，发展以客户为导向的管理流程，善用多项品质管理工具，持续衡量与监控各项流程的效率与有效性，来满足客户需求与期待，以提升竞争的优势。
