Achieve highest customer satisfaction
Optimization of process capability
Continuous improvement
IC Packaging & Testing Services
Vertical integration and Diversification
Efficiency enhancement and cost reduction
Electronics Manufacturing Services
Provide customizable service
Reduce time to market
封裝測試服務
垂直整合多元化服務
提升效率有效降低成本
電子製造服務
提供客製化服務
力求短時間協助客戶產品上市
專業的研發團隊及最先進的封裝技術，滿足客戶需求
最佳製程能力 持續不斷改善
別具競爭力的客製化解決方案
豐富產業經驗及創新專業技能
Technology
Professional research and development
team & advanced assembly technique
System in Package
An example SiP can contain several chips such as a specialized processor, DRAM, flash memory combined with passive components resistors and capacitors all mounted on the same substrate.
Application
Custom Packaging Solutions
Extensive industrial experiences and advanced techniques
Artificial Intelligence
Automotive
Internet of Things (IoT)
Consumer Electronics
Networking- 5G
