IC Packaging &
Testing Services

Vertical integration and Diversification
Efficiency enhancement and cost reduction

Electronics Manufacturing Services

Provide customizable service
Reduce time to market

封裝測試服務

垂直整合多元化服務

提升效率有效降低成本

電子製造服務

提供客製化服務

力求短時間協助客戶產品上市

Quality Management System​

Achieve highest customer satisfaction

Optimization of process capability
Continuous improvement

技術

專業的研發團隊及最先進的封裝技術,滿足客戶需求

最佳製程能力 持續不斷改善

應用

別具競爭力的客製化解決方案

豐富產業經驗及創新專業技能

Technology
Professional research and development team
& advanced assembly technique
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System in Package

An example SiP can contain several chips such as a specialized processor, DRAM, flash memory combined with passive components resistors and capacitors all mounted on the same substrate.

Application

Custom Packaging Solutions

Extensive industrial experiences and advanced techniques

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Artificial Intelligence

  • Flash memory card
  • eMMC/ eMCP/ Flash BGA
  • SiP


  • Automotive

  • Lead frame package
  • CSP Package
  • Flash memory card
  • eMMC/ eMCP/ Flash BGA
  • SiP
  • Internet of Things (IoT)

  • Lead frame package
  • CSP Package
  • Flash memory card
  • eMMC/ eMCP/ Flash BGA
  • SiP
  • Consumer Electronics

  • Lead frame package
  • CSP Package
  • SiP


  • Networking- 5G

  • Lead frame package
  • CSP Package
  • SiP


  • Industrial Grade

  • CSP Package
  • Flash memory card
  • eMMC/ eMCP/ Flash BGA
  • SiP

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