DFN/QFN
DFN/QFN
Cost-effective packaging solution
Cost-effective packaging solution
DFN / QFN is a leadless plastic encapsulated package with metal lead frame that has small package size, lightweight while maintaining good thermal and electrical performance.
DFN (Dual Flat No Lead Package) :
Leads extending from two sides of the body, lead height is less than 0.025mm.
TDFN (Thin Profile Dual Flat No Lead Package) : Total height is greater than 0.8mm, less than 1.0mm.
WDFN (Very Very Thin Profile Dual Flat No Lead Package) : Total height is less than 0.8mm.
QFN (Quad Flat No Lead Package)：Leads extending from four sides of the body, lead height is less than 0.025mm.
TQFN (Thin Profile Quad Flat No Lead Package) : Total height is greater than 0.8mm, less than 1.0mm.
WQFN (Very Very Thin profile Quad Flat No Lead Package) : Total height is less than 0.8mm.
Application
• Consumer Product
• Handheld Device
• Computer
• Communication Device
• Controller
Advantage
• Meet JEDEC Standard
• Multi-die Production Capability
• Turnkey Solution
• Pb Free and RoHS Compliant
• 100% Pure Tin
DFN/QFN Reliability Test Condition
Test samples will be subjected to Jedec Std MSL 3 pre-conditioning unless the customer has special requirements.
| Test Item | Application | Method | Condition | Remark |
| Pre-Condition | JEDEC-STD-22 | A113 | MSL 3 | |
| Temp. Cycle | JEDEC-STD-22 | A104 | -65+0/-10°C & 150+15/-0°C |
Air to Air 2 cycles per hour |
| High Temp. Storage | JEDEC-STD-22 | A103 | 150+10/-0°C | |
| Pressure Cooker | JEDEC-STD-22 | A102 | 121°C/100%R.H. 29.7 psia |
|
| HAST | JEDEC-STD-22 | A118 | 130°C/85%R.H. 33.3 psia |
Without Bias |
| Steady temp./ Humidity |
JEDEC-STD-22 | A101 | 85°C/85%R.H. | Without Bias |
Cross-section Diagram of DFN/QFN
DFN/QFN Specification
| Package name | Pin Count | Package size(mm) |
|---|---|---|
|
DFN
|
8 ~ 20 |
2 X 3 ~ 6 X 8
|
|
QFN |
16~100 |
3 X 3 ~ 12 X 12
|
* Offers Product Customization
