LQFP/TQFP
LQFP/TQFP
LQFP / TQFP helps reduce product thickness and increase board density, suitable for applications required small outline and lightweight.
LQFP (Low Profile Quad Flat Package)： Total height is greater than 1.2mm, less than 1.7mm.
TQFP (Thin Profile Quad Flat Package)： Total height is less than 1.2mm.
Application
• Memory
• Portable Consumer Product
• Cell Phone
• Radio
• Personal Computer
• Automobile
• Controller
• Optoelectronic Component
Advantage
• Meet JEDEC Standard
• Multi-die Production Capability
• Turnkey Solution
• Pb Free and RoHS Compliant
• 100% Pure Tin
LQFP/TQFP Reliability Test Condition
Test samples will be subjected to Jedec Std MSL 3 pre-conditioning unless the customer has special requirements.
| Test Item | Application | Method | Condition | Remark |
| Pre-Condition | JEDEC-STD-22 | A113 | MSL 3 | |
| Temp. Cycle | JEDEC-STD-22 | A104 | -65+0/-10°C & 150+15/-0°C | Air to Air 2 cycles per hour |
| High Temp. Storage | JEDEC-STD-22 | A103 | 150+10/-0°C | |
| Pressure Cooker | JEDEC-STD-22 | A102 | 121°C/100%R.H. 29.7 psia | |
| HAST | JEDEC-STD-22 | A118 | 130°C/85%R.H. 33.3 psia | Without Bias |
| Steady temp./ Humidity | JEDEC-STD-22 | A101 | 85°C/85%R.H. | Without Bias |
Cross-section Diagram of LQFP/TQFP
LQFP/TQFP Specification
| Package name | Package size(mm) | Pin Count(mm) |
|---|---|---|
|
LQFP / TQFP
|
7 X 7
|
48 / 64
|
* Offers Product Customization
