ePoP
ePoP (Embedded Package on Package)
High speed, high efficiency and light weight
High speed, high efficiency and light weight
ePoP(Embedded Package on Package) is a highly integrated package designed for high-end products and meet the requirements of high-speed, high-efficiency and exquisite. ePOP consists of eMMC and LPDDR in one package that could be stacked directly on top of compatible CPU and saves lots of internal space as well as enhance the stability of device since the ePOP is close to CPU.
Application
• High-end smartphone
• Wearable device
• Smart glasses
Advantage
• Space-saving
• Ultra-thin wearable device
• Better heat dissipation
• High-efficiency device
ePoP Reliability Test Condition
Test samples will be subjected to Jedec Std MSL 3 pre-conditioning unless the customer has special requirements.
| Test Item | Application | Method | Condition | Remark |
| Pre-Condition | JEDEC-STD-22 | A113 | MSL 3 | |
| Temp. Cycle | JEDEC-STD-22 | A104 | -65+0/-10℃ & 150+15/-0℃ |
Air to Air 2 cycles per hour |
| High Temp. Storage | JEDEC-STD-22 | A103 | 150+10/-0℃ | |
| HAST | JEDEC-STD-22 | A118 | 130℃/85%R.H. 33.3 psia |
Without Bias |
Cross-section Diagram of
ePoP
ePoP Specification
| Package name | Ball count | Package size(mm) | Ball Pitch(mm) |
|---|---|---|---|
|
ePOP
|
136
|
10 X 10
|
0.5
|
|
|
144
|
10.2 X 8
8 X 9.5 |
0.5
|
* Offers Product Customization
