To satisfy our customers’ targets through optimization of process capability and continuous improvement throughout our organization.
OSE is a customer-oriented company developing multi management systems. Our quality and service are admirable for customers. Many significant customers become good partners with OSE in business.
OSE is a historic and international semiconductor assembling and testing company with leading assembling technology . Our commitment in product delivery is capable to meet customers’ requirements and strict implementation in quality control. For customers, we firmly persist in performing satisfactory continual improvement.
Quality Management System
OSE established a quality management system according IATF 16949 and ISO 9001 including six customer-oriented processes: customer communication process, product and process development process, purchasing and material management process, ordering process, manufacturing process and after sales process. We define key performance indicators(KPI) for each process to continually assess and monitor it effectiveness and efficiency. Also, OSE is assessed and verified as meeting of requirements of IATF 16949, ISO 9001, ISO 14001, OHSAS 18001 and ANSI/ESD S20.20.
Total Quality Management
OSE develops total quality management aiming at design QA, supplier QA, manufacturing QA and sales and services QA, also at cost, delivery, human resource and environment and safety.
OSE continually converts customers’ requirements and internal needs into customer expectation and standardization by external audit and internal diagnoses and supporting by education and on-the job training.
Failure Analysis Lab
With the advanced equipment, OSE FA Lab has the capability to perform the failure analysis requests from customers and internal engineers for the continuous quality improvement.
FA requests from customers and internal engineers
■High/Low optical Microscope
■Precison sectioning Saw
Curve tracer is a electronic test equipment used to analyze the characteristics of semiconductor devices.
SEC X-eye SF-160
Real time observation
X-ray is used for illustrate the internal structure through x-ray.
SAM (Scanning Acoustic Microscope)
SAM is used to examine, measure and photograph the IC structure with supersonic waves.
SEM (Scanning Electron Microscope) & EDS (Energy Dispersive Spectrograph)
SEM is a type of electron microscope that produces images of a sample by scanning the surface with a focused beam of electrons.
EDS is an analytical technique used for the elemental analysis or chemical characterization of a sample.
Real Zoom Lens: 20~200X/ 100X~1000X
Digital microscope is an optical microscope that uses optics and a digital camera to magnify the sample with 3D contrast (DOF) to output to the monitor .
High/Low Power Optical Microscope
High/Low Power Optical Microscope is a type of microscope to use visible light and a system of lenses to magnify the preliminary inspection of sample surface structure.
Variable platen speed:
The Grinding and Polishing machine is the tool used to grind/polish the sample near-by the suspected point for further investigations.
Precision Sectioning Saw
Various Blade Type, Max Speed:4000 rpm
Precision Sectioning Saw is the machine tools used for cutting the sample before grinding.
Con Semi FAT cat II
I.R. Laser: 20 watt
Laser Decap is the process of removing the protective cover of a microchip so that the contained die is revealed for visual inspection of the micro circuitry imprinted on the die.
A/ V : 0 to 6 kV
Milling rate (max.) : (Materials Si)
For X-section milling: 300μm/hour
For Flat milling: 2~20μm/hour
Ion milling machine thins the sample until it is transparent to electrons by firing ions at the surface from an angle and sputtering material from the surface.
Probe station is used to physically acquire signals from the internal nodes of a semiconductor device.
Failure Analysis Equipment
|1.||High/Low Power Optical Microscope||Nikon||LV 150||1||Eyepiece:10X, Objective Lens:2.5X/10X/20X/50X/100X|
|OPTIPHOT-150||1||Eyepiece:10X, Objective Lens:5X/20X/50X/100X|
|2.||Digital Microscope||KEYENCE||VHX-1000||1||Real Zoom Lens: 20~200X/ 100X~1000X|
|3.||X-ray||Fein Focus||FX100.20||2||Real time observation|
|SEC||X-eye SF-160||1||Real time observation|
|4.||SAM (Scanning Acoustic Microscope)||SonoScan||P300||1||Transducer frequency: 15MHz/20MHz/30MHz|
|5.||Curve Tracer||KEITHLEY||2636B||1||Resolution: 1fA/1uV|
|6.||Laser Decap||Con Semi||FAT cat II||1||I.R. Laser: 20 watt|
|7.||SEM (Scanning Electron Microscope)||Hitachi||S-3500N||1||A/V.:5KV~20KV, Magnification: 10X~100000X|
|SU8010||1||A/V.:0.5KV~30KV, Magnification: 10X~100000X|
|8.||EDS (Energy Dispersive Spectrograph)||HORIBA||X-max||1||Z: 5~92, detector area：50mm²|
|9.||Probe Station||MM||6000||1||4 Manipulator|
|10.||Cross Section Machine||Allied||MET PREP 8||1||Variable Speed Control: 40~500 rpm|
|M-PREP5TM||1||Variable Speed with digital display: 10-500 rpm|
|Struers||Tegramin-20||1||Variable platen speed: 40~600 rpm|
|11.||Ion Milling||Hitachi||IM4000||1||A/ V : 0 to 6 kV Milling rate (max.) : (Materials Si) For X-section milling: 300μm/hour For Flat milling: 2~20μm/hour|
|12.||Precision Sectioning Saw||Allied||20-1000||1||Various Blade Type, Max Speend:4000 rpm|
OSE establishes quality management system according to IATF 16949 and ISO 9001 and develops customer-oriented processes. We continually assess and monitor effectiveness and efficiency and use many kinds of quality management tools to satisfy out customers and expectation and enhance advantage competition.