Quality Management System

Quality Policy

To satisfy our customers’ targets through optimization of process capability and continuous improvement throughout our organization.

OSE is a customer-oriented company developing multi management systems. Our quality and service are admirable for customers. Many significant customers become good partners with OSE in business.
OSE is a historic and international semiconductor assembling and testing company with leading assembling technology . Our commitment in product delivery is capable to meet customers’ requirements and strict implementation in quality control. For customers, we firmly persist in performing satisfactory continual improvement.

Quality Management System

OSE established a quality management system according IATF 16949 and ISO 9001 including six customer-oriented processes: customer communication process, product and process development process, purchasing and material management process, ordering process, manufacturing process and after sales process. We define key performance indicators(KPI) for each process to continually assess and monitor it effectiveness and efficiency. Also, OSE is assessed and verified as meeting of requirements of IATF 16949, ISO 9001, ISO 14001, OHSAS 18001 and ANSI/ESD S20.20.

Total Quality Management

OSE develops total quality management aiming at design QA, supplier QA, manufacturing QA and sales and services QA, also at cost, delivery, human resource and environment and safety.
OSE continually converts customers’ requirements and internal needs into customer expectation and standardization by external audit and internal diagnoses and supporting by education and on-the job training.

OSE Certificate

IATF 16949:2016

ISO 9001:2015

ISO 14001:2015

OHSAS 18001:2007

ANSI/ESD S20.20 :2014

Failure Analysis Lab

With the advanced equipment, OSE FA Lab has the capability to perform the failure analysis requests from customers and internal engineers for the continuous quality improvement.


FA request

FA requests from customers and internal engineers

Non-destructive Analysis

■Curve Tracer
■SAM
■X-Ray
■SEM&EDX
■Digital Microscope
■High/Low optical Microscope


Destructive Analysis

■Grinding/Polishing Machine
■Precison sectioning Saw
■Probe Station
■Laser Decap
■Ion Milling


FA Report

Failure analysis report

Non-destructive Analysis

Curve Tracer

KEITHLEY 2600-PCT

Capability

30W, 2000V/0.1A,20V/1.5A

Application

Curve tracer is a electronic test equipment used to analyze the characteristics of semiconductor devices.

X-ray

SEC X-eye SF-160

Capability

Real time observation

Application

X-ray is used for illustrate the internal structure through x-ray.

SAM (Scanning Acoustic Microscope)

Sonoscan P300

Capability

Transducer frequency:
10MHz/15MHz/30MHz/50MHz/100MHz

Application

SAM is used to examine, measure and photograph the IC structure with supersonic waves.

SEM (Scanning Electron Microscope) & EDS (Energy Dispersive Spectrograph)

Hitachi SU8010(SEM)
HORIBA X-max(EDS)

Capability

A/V.:0.5KV~30KV,
Magnification: 10X~100000X

Application

SEM is a type of electron microscope that produces images of a sample by scanning the surface with a focused beam of electrons.
EDS is an analytical technique used for the elemental analysis or chemical characterization of a sample.

Digital Microscope

KEYENCE VHX-6000

Capability

Real Zoom Lens: 20~200X/ 100X~1000X

Application

Digital microscope is an optical microscope that uses optics and a digital camera to magnify the sample with 3D contrast (DOF) to output to the monitor .

High/Low Power Optical Microscope

Nikon LV150

Capability

Eyepiece: 10X
Objective Lens:
2.5X/10X/20X/50X/100X

Application

High/Low Power Optical Microscope is a type of microscope to use visible light and a system of lenses to magnify the preliminary inspection of sample surface structure.

Destructive Analysis

Grinding/Polishing Machine

Struers Tegramin-20

Capability

Variable platen speed:
40~600 rpm

Application

The Grinding and Polishing machine is the tool used to grind/polish the sample near-by the suspected point for further investigations.

Precision Sectioning Saw

Allied 20-1000

Capability

Various Blade Type, Max Speed:4000 rpm

Application

Precision Sectioning Saw is the machine tools used for cutting the sample before grinding.

Laser Decap

Con Semi FAT cat II

Capability

I.R. Laser: 20 watt

Application

Laser Decap is the process of removing the protective cover of a microchip so that the contained die is revealed for visual inspection of the micro circuitry imprinted on the die.

Ion Milling

Hitachi IM4000

Capability

A/ V : 0 to 6 kV
Milling rate (max.) : (Materials Si)
For X-section milling: 300μm/hour
For Flat milling: 2~20μm/hour

Application

Ion milling machine thins the sample until it is transparent to electrons by firing ions at the surface from an angle and sputtering material from the surface.

Probe Station

MM 6000

Capability

4 Manipulator

Application

Probe station is used to physically acquire signals from the internal nodes of a semiconductor device.

Failure Analysis Equipment

S/NEquipmentManufacturerModelSetCapability
1.SAM(Scanning Acoustic Microscope)SonoScanP3001Transducer frequency: 10MHz/15MHz/30MHz/50MHz/100MHz
2.SEM(Scanning Electron Microscope)HitachiS-3500N1A/V.:5KV~20KV,
Magnification: 10X~100000X
SU80101A/V.:0.5KV~30KV, Magnification: 10X~100000X
3.EDS(Energy Dispersive Spectrograph)HORIBAX-max1Z: 5~92, detector area:50mm²
4.Curve TracerTektronix370A10.08W~220W, Max.2000V
KEITHLEY2600-PCT130W, 200V/0.1A, 20V/1.5A
5.Probe StationMM600014 Manipulator
6.High/Low Power Optical MicroscopeNikonLV 1501Eyepiece:10X,
LV 150N1Objective Lens:2.5X/10X/20X/50X/100X
OPTIPHOT-1501Eyepiece:10X, Objective Lens:5X/20X/50X/100X
7.Digital MicroscopeKEYENCEVHX-10001Real Zoom Lens: 20~200X/ 100X~1000X
VHX-60001Real Zoom Lens: 20~200X/ 100X~2000X
8.Cross Section MachineAlliedMET PREP 81Variable Speed Control: 40~500 rpm
M-PREP5TM1Variable Speed with digital display: 10-500 rpm
PH-3/AD-51Variable platen speed: 40~600 rpm
StruersTegramin-201Variable platen speed: 40~600 rpm
9.Precision Sectioning SawAllied20-10002Various Blade Type, Max Speend:4000 rpm
10.X-rayFein FocusFX100.202Real time observation
SECX-eye SF-1601Real time observation
11.Ion MillingHitachiIM40001A/ V : 0 to 6 kV
Milling rate (max.) : (Materials Si)
For X-section milling: 300μm/hour
For Flat milling: 2~20μm/hour
12.Laser DecapCon SemiFAT cat II1I.R. Laser: 20 watt

OSE establishes quality management system according to IATF 16949 and ISO 9001 and develops customer-oriented processes. We continually assess and monitor effectiveness and efficiency and use many kinds of quality management tools to satisfy out customers and expectation and enhance advantage competition.

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