Quality Policy
To satisfy our customers’ targets through optimization of process capability and continuous improvement throughout our organization.
OSE is a customer-oriented company developing multi management systems. Our quality and service are admirable for customers. Many significant customers become good partners with OSE in business.
OSE is a historic and international semiconductor assembling and testing company with leading assembling technology . Our commitment in product delivery is capable to meet customers’ requirements and strict implementation in quality control. For customers, we firmly persist in performing satisfactory continual improvement.
Quality Management System
OSE established a quality management system according IATF 16949 and ISO 9001 including six customer-oriented processes: customer communication process, product and process development process, purchasing and material management process, ordering process, manufacturing process and after sales process. We define key performance indicators(KPI) for each process to continually assess and monitor it effectiveness and efficiency. Also, OSE is assessed and verified as meeting of requirements of IATF 16949, ISO 9001, ISO 13485、AS9100、ISO 14001, ISO 45001 and ANSI/ESD S20.20.
Total Quality Management
OSE develops total quality management aiming at design QA, supplier QA, manufacturing QA and sales and services QA, also at cost, delivery, human resource and environment and safety.
OSE continually converts customers’ requirements and internal needs into customer expectation and standardization by external audit and internal diagnoses and supporting by education and on-the job training.
OSE Certificate
Our certifications attest our commitment to comply with international quality and environmental standards.
We work, however, to not only comply with these standards, but also continuously improve the effectiveness of our entire quality management system. Compliance with TAA(Trade Agreement Act).
IC SERVICES
IATF 16949:2016
ISO 9001:2015
EMS SERVICES
IATF 16949:2016
ISO 9001:2015
ISO 13485:2016
AS9100:D
EHS SERVICES
ISO 14001:2015
ISO 45001:2018
CNS 45001:2018
ANSI/ESD S20.20 :2014
ISO 50001:2018
ISO 46001:2019
ISO 14064-1:2018 (Year 2021)
ISO 14064-1:2018 (Year 2022)
Information Security
ISO/IEC 27001:2022
Failure Analysis Lab
With the advanced equipment, OSE FA Lab has the capability to perform the failure analysis requests from customers and internal engineers for the continuous quality improvement.
FA request
FA requests from customers and internal engineers
Non-destructive Analysis
■Curve Tracer
■SAM
■X-Ray
■SEM&EDX
■Digital Microscope
■High/Low optical Microscope
Destructive Analysis
■Grinding/Polishing Machine
■Precison sectioning Saw
■Probe Station
■Laser Decap
■Ion Milling
FA Report
Failure analysis report
Non-destructive Analysis
Curve Tracer
KEITHLEY 2636B
Capability
1fA/1mV
Application
Curve tracer is a electronic test equipment used to analyze the characteristics of semiconductor devices.
X-ray
SEC X-eye SF-160
Capability
Real time observation
Application
X-ray is used for illustrate the internal structure through x-ray.
SAM (Scanning Acoustic Microscope)
Sonoscan D9650
Capability
Transducer frequency:
15MHz/30MHz/50MHz/100MHz
Application
SAM is used to examine, measure and photograph the IC structure with supersonic waves.
SEM (Scanning Electron Microscope) & EDS (Energy Dispersive Spectrograph)
Hitachi SU8010(SEM)
HORIBA X-max(EDS)
Capability
A/V.:0.5KV~30KV,
Magnification: 10X~100000X / Z：5~92
Detector area：50mm²
Application
SEM is a type of electron microscope that produces images of a sample by scanning the surface with a focused beam of electrons.
EDS is an analytical technique used for the elemental analysis or chemical characterization of a sample.
Digital Microscope
KEYENCE VHX-7000 / EA300
Capability
Real Zoom Lens: 20X~4000X / Z: 1~92
Application
Digital microscope is an optical microscope that uses optics and a digital camera to magnify the sample with 3D contrast (DOF) to output to the monitor .
High/Low Power Optical Microscope
Nikon LV150
Capability
Eyepiece: 10X
Objective Lens:
2.5X/10X/20X/50X/100X
Application
High/Low Power Optical Microscope is a type of microscope to use visible light and a system of lenses to magnify the preliminary inspection of sample surface structure.
Destructive Analysis
Grinding/Polishing Machine
Struers Tegramin-20
Capability
Variable platen speed:
40~600 rpm
Application
The Grinding and Polishing machine is the tool used to grind/polish the sample near-by the suspected point for further investigations.
Precision Sectioning Saw
Allied 20-1000
Capability
Various Blade Type, Max Speed:4000 rpm
Application
Precision Sectioning Saw is the machine tools used for cutting the sample before grinding.
Laser Decap
Con Semi FAT cat II
Capability
I.R. Laser: 20 watt
Application
Laser Decap is the process of removing the protective cover of a microchip so that the contained die is revealed for visual inspection of the micro circuitry imprinted on the die.
Ion Milling
Hitachi IM4000
Capability
A/ V : 0 to 6 kV
Milling rate (max.) : (Materials Si)
For X-section milling: 300μm/hour
For Flat milling: 2~20μm/hour
Application
Ion milling machine thins the sample until it is transparent to electrons by firing ions at the surface from an angle and sputtering material from the surface.
Probe Station
MM 6000
Capability
4 Manipulator
Application
Probe station is used to physically acquire signals from the internal nodes of a semiconductor device.
Failure Analysis Equipment
| S/N | Equipment | Manufacturer | Model | Set | Capability |
| 1 | High/Low Power Optical Microscope | Nikon | LV 150 | 1 |
Eyepiece:10X, Objective Lens:2.5X/10X/20X/50X/100X |
| LV 150N | 1 | ||||
| 2 | Digital Microscope | KEYENCE | VHX-7000 / EA300 | 1 | Real Zoom Lens: 20~2000X / Z: 1~92 |
| VHX-7000 | 1 | Real Zoom Lens: 20~4000X | |||
| 3 | X-ray | SEC | X-eye SF-160 | 1 | Real time observation |
| YXLON | Y.CHEETAH | 1 | |||
| COUGAR | 2 | ||||
| Y.COUGAR SMT | 4 | ||||
| 4 | SAM (Scanning Acoustic Microscope) | SonoScan | D9650 | 1 | Transducer frequency: 15MHz/ 30MHz/50MHz/ 100MHz |
| 5 | Curve Tracer | KEITHLEY | 2636B | 2 | Resolution: 1fA/1mV |
| 6 | Laser Decap | Con Semi | FAT cat II | 1 | I.R. Laser: 20 watt |
| 7 | SEM (Scanning Electron Microscope) | Hitachi | S-3500N | 1 | A/V.:5KV~20KV, Magnification: 10X~100000X |
| SU8010 | 1 | A/V.:0.5KV~30KV, Magnification: 10X~100000X / Z：5~92 |
|||
| 8 | EDS (Energy Dispersive Spectrograph) | HORIBA | X-max | 1 | Detector area：50mm² |
| 9 | Probe Station | MM | 6000 | 1 | 4 Manipulator |
| 10 | Cross Section Machine | Struers | Tegramin-20 | 1 | Variable platen speed: 40~600 rpm |
| 11 | Ion Milling | Hitachi | IM4000 | 1 |
A/ V : 0 to 6 kV Milling rate (max.) : (Materials Si) For X-section milling: 300μm/hour For Flat milling: 2~20μm/hour |
| 12 | Precision Sectioning Saw | Allied | 20-1000 | 1 | Various Blade Type, Max Speend:4000 rpm |
OSE establishes quality management system according to IATF 16949 and ISO 9001 and develops customer-oriented processes. We continually assess and monitor effectiveness and efficiency and use many kinds of quality management tools to satisfy out customers and expectation and enhance advantage competition.
