品質管理系統

品質政策

以最佳的製程能力及持續不斷的改善,
滿足客戶的最高滿意度。

華泰電子以客戶的需求為導向,發展多個管理系統,品質與服務深受客戶的青睞,也與相當多的重要客戶成為事業上的好夥伴。 華泰電子為歷史悠久的國際級半導體封裝測試廠,封裝技術能力領先業界,我們承諾為所交付給客戶的產品與服務能符合客戶需求,為客戶做好品質把關,並透過不斷地持續改善,以滿足客戶的需求。

品質管理系統

華泰電子依據IATF 16949以及ISO 9001建立品質管理系統體系,建立了六大客戶導向流程:客戶溝通、產品與流程發展、採購與物控、訂單處理、生產製造與售後服務,並定義各項流程的關鍵績效指標,持續衡量與監控過程的效率與有效性。此外,華泰電子也通過IATF 16949、ISO 9001、ISO 14001、OHSAS 18001、CNS 15506、ANSI/ESD S20.20等認證。

全面品質管理

華泰電子依據IATF 16949以及ISO 9001建立品質管理系統體系,發展以客戶為導向的管理流程,善用多項品質管理工具,持續量測與監控各項流程的效率與有效性,來滿足客戶需求與期待,以提升競爭的優勢。

國際認證

IATF 16949:2016

ISO 9001:2015

ISO 14001:2015

OHSAS 18001:2007

ANSI/ESD S20.20 :2014

失敗分析實驗室

華泰電子擁有先進的儀器與實驗設備,有能力依厰內及客戶的回饋進行相關性的失敗分析(Failure Analysis, FA ) ,進行持續性的品質改善。

需求

客戶回饋/內部需求

非破壞性分析

■Curve Tracer
■SAM
■X-Ray
■SEM&EDX
■Digital Microscope
■High/Low optical Microscope

破壞性分析

■Grinding/Polishing Machine
■Precison sectioning Saw
■Probe Station
■Laser Decap
■Ion Milling

報告

分析報告

非破壞性分析

Curve Tracer

KEITHLEY 2600-PCT

Capability

30W, 2000V/0.1A,20V/1.5A

Application

Curve tracer is a electronic test equipment used to analyze the characteristics of semiconductor devices.

X-ray

SEC X-eye SF-160

Capability

Real time observation

Application

X-ray is used for illustrate the internal structure through x-ray.

SAM (Scanning Acoustic Microscope)

Sonoscan P300

Capability

Transducer frequency:
10MHz/15MHz/30MHz/50MHz/100MHz

Application

SAM is used to examine, measure and photograph the IC structure with supersonic waves.

SEM (Scanning Electron Microscope) & EDS (Energy Dispersive Spectrograph)

Hitachi SU8010(SEM)
HORIBA X-max(EDS)

Capability

A/V.:0.5KV~30KV,
Magnification: 10X~100000X

Application

SEM is a type of electron microscope that produces images of a sample by scanning the surface with a focused beam of electrons.
EDS is an analytical technique used for the elemental analysis or chemical characterization of a sample.

Digital Microscope

KEYENCE VHX-6000

Capability

Real Zoom Lens: 20~200X/ 100X~1000X

Application

Digital microscope is an optical microscope that uses optics and a digital camera to magnify the sample with 3D contrast (DOF) to output to the monitor .

High/Low Power Optical Microscope

Nikon LV150

Capability

Eyepiece: 10X
Objective Lens:
2.5X/10X/20X/50X/100X

Application

High/Low Power Optical Microscope is a type of microscope to use visible light and a system of lenses to magnify the preliminary inspection of sample surface structure.

破壞性分析

Grinding/Polishing Machine

Struers Tegramin-20

Capability

Variable platen speed:
40~600 rpm

Application

The Grinding and Polishing machine is the tool used to grind/polish the sample near-by the suspected point for further investigations.

Precision Sectioning Saw

Allied 20-1000

Capability

Various Blade Type, Max Speed:4000 rpm

Application

Precision Sectioning Saw is the machine tools used for cutting the sample before grinding.

Laser Decap

Con Semi FAT cat II

Capability

I.R. Laser: 20 watt

Application

Laser Decap is the process of removing the protective cover of a microchip so that the contained die is revealed for visual inspection of the micro circuitry imprinted on the die.

Ion Milling

Hitachi IM4000

Capability

A/ V : 0 to 6 kV
Milling rate (max.) : (Materials Si)
For X-section milling: 300μm/hour
For Flat milling: 2~20μm/hour

Application

Ion milling machine thins the sample until it is transparent to electrons by firing ions at the surface from an angle and sputtering material from the surface.

Probe Station

MM 6000

Capability

4 Manipulator

Application

Probe station is used to physically acquire signals from the internal nodes of a semiconductor device.

Failure Analysis Equipment

S/NEquipmentManufacturerModelSetCapability
1.SAM(Scanning Acoustic Microscope)SonoScanP3001Transducer frequency: 10MHz/15MHz/30MHz/50MHz/100MHz
2.SEM(Scanning Electron Microscope)HitachiS-3500N1A/V.:5KV~20KV,
Magnification: 10X~100000X
SU80101A/V.:0.5KV~30KV, Magnification: 10X~100000X
3.EDS(Energy Dispersive Spectrograph)HORIBAX-max1Z: 5~92, detector area:50mm²
4.Curve TracerTektronix370A10.08W~220W, Max.2000V
KEITHLEY2600-PCT130W, 200V/0.1A, 20V/1.5A
5.Probe StationMM600014 Manipulator
6.High/Low Power Optical MicroscopeNikonLV 1501Eyepiece:10X,
LV 150N1Objective Lens:2.5X/10X/20X/50X/100X
OPTIPHOT-1501Eyepiece:10X, Objective Lens:5X/20X/50X/100X
7.Digital MicroscopeKEYENCEVHX-10001Real Zoom Lens: 20~200X/ 100X~1000X
VHX-60001Real Zoom Lens: 20~200X/ 100X~2000X
8.Cross Section MachineAlliedMET PREP 81Variable Speed Control: 40~500 rpm
M-PREP5TM1Variable Speed with digital display: 10-500 rpm
PH-3/AD-51Variable platen speed: 40~600 rpm
StruersTegramin-201Variable platen speed: 40~600 rpm
9.Precision Sectioning SawAllied20-10002Various Blade Type, Max Speend:4000 rpm
10.X-rayFein FocusFX100.202Real time observation
SECX-eye SF-1601Real time observation
11.Ion MillingHitachiIM40001A/ V : 0 to 6 kV
Milling rate (max.) : (Materials Si)
For X-section milling: 300μm/hour
For Flat milling: 2~20μm/hour
12.Laser DecapCon SemiFAT cat II1I.R. Laser: 20 watt

華泰電子依據IATF 16949以及ISO 9001建立品質管理系統體系,發展以客戶為導向的管理流程,善用多項品質管理工具,持續衡量與監控各項流程的效率與有效性,來滿足客戶需求與期待,以提升競爭的優勢。

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