品質政策
以最佳的製程能力及持續不斷的改善，
滿足客戶的最高滿意度。
華泰電子以客戶的需求為導向，發展多個管理系統，品質與服務深受客戶的青睞，也與相當多的重要客戶成為事業上的好夥伴。 華泰電子為歷史悠久的國際級半導體封裝測試廠，封裝技術能力領先業界，我們承諾為所交付給客戶的產品與服務能符合客戶需求，為客戶做好品質把關，並透過不斷地持續改善，以滿足客戶的需求。
品質管理系統
華泰電子依據IATF 16949以及ISO 9001建立品質管理系統體系，建立了六大客戶導向流程：客戶溝通、產品與流程發展、採購與物控、訂單處理、生產製造與售後服務，並定義各項流程的關鍵績效指標，持續衡量與監控過程的效率與有效性。此外，華泰電子通過IATF 16949、ISO 9001、ISO 13485、AS9100、ISO 14001、ISO 45001、ANSI/ESD S20.20等認證。
全面品質管理
華泰電子依據IATF 16949以及ISO 9001建立品質管理系統體系，發展以客戶為導向的管理流程，善用多項品質管理工具，持續量測與監控各項流程的效率與有效性，來滿足客戶需求與期待，以提升競爭的優勢。
國際認證
透過取得各項的認證來達成我們對品質的承諾，我們不僅僅是導入這些國際標準，而且要持續改善整體品質管理系統的有效性。亦符合TAA貿易協定法規範。
封裝測試服務
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IATF 16949:2016
ISO 9001:2015
電子製造服務
IATF 16949:2016
ISO 9001:2015
ISO 13485:2016
AS9100:D
環境與職業安全衛生管理
ISO 14001:2015
ISO 45001:2018
CNS 45001:2018
ANSI/ESD S20.20 :2021
ISO 50001:2018
ISO 46001:2019
ISO 14064-1:2018 (2021年)
ISO 14064-1:2018 (2022年)
資訊安全
ISO/IEC 27001:2022
有害物質管理
IECQ QC080000
失敗分析實驗室
華泰電子擁有先進的儀器與實驗設備，有能力依厰內及客戶的回饋進行相關性的失敗分析(Failure Analysis, FA ) ，進行持續性的品質改善。
需求
客戶回饋/內部需求
非破壞性分析
■Curve Tracer
■SAM
■X-Ray
■SEM&EDX
■Digital Microscope
■High/Low optical Microscope
破壞性分析
■Grinding/Polishing Machine
■Precison sectioning Saw
■Probe Station
■Laser Decap
■Ion Milling
報告
分析報告
非破壞性分析
Curve Tracer
KEITHLEY 2636B
Capability
1fA/1mV
Application
Curve tracer is a electronic test equipment used to analyze the characteristics of semiconductor devices.
X-ray
SEC X-eye SF-160
Capability
Real time observation
Application
X-ray is used for illustrate the internal structure through x-ray.
SAM (Scanning Acoustic Microscope)
Sonoscan D9650
Capability
Transducer frequency:
15MHz/30MHz/50MHz/100MHz
Application
SAM is used to examine, measure and photograph the IC structure with supersonic waves.
SEM (Scanning Electron Microscope) & EDS (Energy Dispersive Spectrograph)
Hitachi SU8010(SEM)
HORIBA X-max(EDS)
Capability
A/V.:0.5KV~30KV,
Magnification: 10X~100000X / Z：5~92
Detector area：50mm²
Application
SEM is a type of electron microscope that produces images of a sample by scanning the surface with a focused beam of electrons.
EDS is an analytical technique used for the elemental analysis or chemical characterization of a sample.
Digital Microscope
KEYENCE VHX-7000 / EA300
Capability
Real Zoom Lens: 20X~4000X / Z: 1~92
Application
Digital microscope is an optical microscope that uses optics and a digital camera to magnify the sample with 3D contrast (DOF) to output to the monitor .
High/Low Power Optical Microscope
Nikon LV150
Capability
Eyepiece: 10X
Objective Lens:
2.5X/10X/20X/50X/100X
Application
High/Low Power Optical Microscope is a type of microscope to use visible light and a system of lenses to magnify the preliminary inspection of sample surface structure.
破壞性分析
Grinding/Polishing Machine
Struers Tegramin-20
Capability
Variable platen speed:
40~600 rpm
Application
The Grinding and Polishing machine is the tool used to grind/polish the sample near-by the suspected point for further investigations.
Precision Sectioning Saw
Allied 20-1000
Capability
Various Blade Type, Max Speed:4000 rpm
Application
Precision Sectioning Saw is the machine tools used for cutting the sample before grinding.
Laser Decap
Con Semi FAT cat II
Capability
I.R. Laser: 20 watt
Application
Laser Decap is the process of removing the protective cover of a microchip so that the contained die is revealed for visual inspection of the micro circuitry imprinted on the die.
Ion Milling
Hitachi IM4000
Capability
A/ V : 0 to 6 kV
Milling rate (max.) : (Materials Si)
For X-section milling: 300μm/hour
For Flat milling: 2~20μm/hour
Application
Ion milling machine thins the sample until it is transparent to electrons by firing ions at the surface from an angle and sputtering material from the surface.
Probe Station
MM 6000
Capability
4 Manipulator
Application
Probe station is used to physically acquire signals from the internal nodes of a semiconductor device.
Failure Analysis Equipment
| S/N | Equipment | Manufacturer | Model | Set | Capability |
| 1 | High/Low Power Optical Microscope | Nikon | LV 150 | 1 |
Eyepiece:10X, Objective Lens:2.5X/10X/20X/50X/100X |
| LV 150N | 1 | ||||
| 2 | Digital Microscope | KEYENCE | VHX-7000 / EA300 | 1 | Real Zoom Lens: 20~2000X / Z: 1~92 |
| VHX-7000 | 1 | Real Zoom Lens: 20~4000X | |||
| 3 | X-ray | SEC | X-eye SF-160 | 1 | Real time observation |
| YXLON | Y.CHEETAH | 1 | |||
| COUGAR | 2 | ||||
| Y.COUGAR SMT | 4 | ||||
| 4 | SAM (Scanning Acoustic Microscope) | SonoScan | D9650 | 1 | Transducer frequency: 15MHz/ 30MHz/50MHz/ 100MHz |
| 5 | Curve Tracer | KEITHLEY | 2636B | 2 | Resolution: 1fA/1mV |
| 6 | Laser Decap | Con Semi | FAT cat II | 1 | I.R. Laser: 20 watt |
| 7 | SEM (Scanning Electron Microscope) | Hitachi | S-3500N | 1 | A/V.:5KV~20KV, Magnification: 10X~100000X |
| SU8010 | 1 | A/V.:0.5KV~30KV, Magnification: 10X~100000X / Z：5~92 |
|||
| 8 | EDS (Energy Dispersive Spectrograph) | HORIBA | X-max | 1 | Detector area：50mm² |
| 9 | Probe Station | MM | 6000 | 1 | 4 Manipulator |
| 10 | Cross Section Machine | Struers | Tegramin-20 | 1 | Variable platen speed: 40~600 rpm |
| 11 | Ion Milling | Hitachi | IM4000 | 1 |
A/ V : 0 to 6 kV Milling rate (max.) : (Materials Si) For X-section milling: 300μm/hour For Flat milling: 2~20μm/hour |
| 12 | Precision Sectioning Saw | Allied | 20-1000 | 1 | Various Blade Type, Max Speend:4000 rpm |
華泰電子依據IATF 16949以及ISO 9001建立品質管理系統體系，發展以客戶為導向的管理流程，善用多項品質管理工具，持續衡量與監控各項流程的效率與有效性，來滿足客戶需求與期待，以提升競爭的優勢。
