Testing Services

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Wafer Probing Test

Specification / MachineUF200UF3000 Ex-e
Wafer Size(inch)6″,8″8″,12″
Temperature25°C~150°C-40°C~150°C
InterfaceGPIBGPIB
OtherINK Solution

The wafer prober is capable of handling 8 and 12-inch wafers.
With specific drive motor, X-Y axis could achieve high speed, soundless, high precision with high output while the Z axis applies 4-axle drive mechanism to enhance the contact stability during probing and ensure the quality of each die.

Automotive Test

OSE provide automotive test.
Major application of automotive products: Infotainment system of automotive; Vehicle motion & Safety; Camera systems of automotive; Diagnostics of automotive.

Handler:Delta Design : Castle
Rasco : SO-1000T
Hon Tech : HT9040S
Seiko Epson : NS6040
Package type: BGA,LFBGA, QFP, LQFP,SSOP, QFN,
Package size: BGA(19×19 289L~ 27×27 400L), LFBGA(9×9 100L~ 10×10 100L)
QFP(14×20 128L~ 28×28 208L), LQFP(7×7 48L~ 14×14 128L)
SSOP( 300mil 48L), QFN( 4×4 24L~ 8×8 64L)
Test site: Max.4
Temp. Range : -40°C~ 125°C.

Flash Memory Test

NAND/Embedded Flash Test service solution.

OSE provide Memory test platform for TSOP/eMCP/eMMC/LPDDR with high DUT handler and controller test solution accordingly, either or apply the high precision auto test equipment and optional high/low temperature burn-in system. Our services provide not only the most compatibility but also stability production environment to make the product applying to smart phone, tablet, digital camera, mobility use, and personal storage device.

TypeeMMCeUFSeMCPePOP
PKG Size (mm)153L169L153L162L221L136L
11.5*137.6*11.19*7.512*1611.5*1311.5*1311.5*1310*10
Apply Smartphone SmartWearableDevice Automotive RemoveableFlashDisk TabletSmartPhone SmartWearableDeviceSmartPhone Tablet SmartWearableDeviceSmartPhone SmartWearableDevice
MachineHON TECH
TypeSSDTSOPLPDDRUSBMicro SDSD
PKG Size (mm)132L152L48L178L4L8L9L
12*1814*1812*2011*11.512*11.511.3*1511.3*2011.3*24.811*1524*32
ApplyDiskDisk ModemCameraSmartPhone TabletSmartPhone TabletRemoveMediaDisk RemoveableFlashDisk SmartPhone CameraRemoveMediaDisk SmartPhone Camera DashcamRemoveMediaDisk SmartPhone Camera Dashcam
MachineHON TECH

System Level Test

OSE has customized testing configuration with System Level Test handler to achieve the functional test of high efficient products. We provide stable testing environment to shorten the lead in time and then increase productive capacity.

TypeWQFNLQFPWQFNTQFNSSOPTSSOP
PKG Size
(mm)
48L48L28L28L32L28L24L20L
6*67*75*54*44*4209MIL150MIL150MIL173MIL
Terminal applicationUSB3.0 Flash application, 3C information peripheral control chipUSB2.0 information peripheral application SD card control chip. Bluetooth video device, Bluetooth mobile transmission device, Bluetooth wearable deviceUSB2.0 information peripheral application 3C information peripheral control chipBluetooth video device, Bluetooth mobile transmission device, Bluetooth wearable device3C information peripheral control chip , NB-Cam control chip

3C information peripheral control chip , NB-Cam control chip

3C information peripheral control chip , NB-Cam control chipBluetooth video device, Bluetooth mobile transmission device, Bluetooth wearable device
HandlerHON TECH SEIKO EPSONRASCO

Integrated Circuit function Test

OSE provide function test of integrated circuit.
Major application of integrated circuit : various devices of electrical installation, smart phone and PC’s motherboard ; ESD protection of device; : various devices of communication installation.

Tester
Advantest , Teradyne , LTX-Credence , Chroma , YTEC

Handler
Pick and Place: Hon. Tech, Seiko Epson, Delta Design
Gravity: Rasco, Multitest
Bowl Feeder: SRM

Handler-Pick and Place

  • Package type: QFP, QFN, BGA, TSOP , SSOP
  • Package size: 3x3~42x42mm
  • Test site: Max.16
  • Temp. Range: -50°C~130°C
  • Manufacturer:
    Hon. Tech
    Seiko Epson
    Delta Design

Handler-Gravity

  • Package type: MSOP, SOP, SSOP, TSSOP, PDIP, PLCC
  • Package size: 118-300MIL
  • Test site: Max.4
  • Temp. Range: -50°C~150°C
  • Manufacturer: Rasco, Multitest

Handler-Bowl Feeder

  • Package type: QFN, DFN
  • Package size: 3x3~5x5mm
  • Test site: Max. 2
  • Temp. Range: Ambient
  • Manufacturer: SRM

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